Surface modification of fiber bundles using atmospheric pressure plasma devices.
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Efficient surface modification method for fiber bundles using atmospheric pressure plasma devices.
The fiber bundle surface modification device can efficiently hydrophilize fiber bundles, such as carbon fibers, brass fibers, and polymer fibers, targeting the interior of the bundle. The plasma treatment width can be freely designed according to the processing speed, and the structure that confines the plasma (radicals) inside the treatment chamber allows for uniform processing throughout the interior of the bundle. The treated work does not become charged. (Patent pending) 【Features】 - Efficient hydrophilization treatment of each individual fiber in the bundle due to the structure that confines the plasma. - High reliability. - Damage-free processing. For more details, please contact us or download the catalog.
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basic information
**Advantages of Atmospheric Pressure Plasma Surface Modification** - No drying process required due to dry treatment - Ability to control the desired contact angle - All areas of active gas (such as OH radicals) can be treated - Can be easily used as a plasma source for hydrophobic/reduction treatment, etching, and CVD equipment by adding various gases - Compact (space-saving) - No post-treatment required for exhaust gases in hydrophilic treatment - No physical damage to the treated surface (downstream type) - No charging after treatment (downstream type) - No change in device performance even when treating semiconductor devices - No UV damage to the treated surface - No particle generation (downstream type) - Precise drying by plasma (without drying marks) is possible - Nitrogen gas consumption reduced by 45% due to high-density plasma generation - By changing the type of added gas, it is possible to select functional groups or amine groups suitable for the bonding material - Direct bonding of similar/dissimilar materials is possible through covalent bond molecule attachment
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Company information
We are expanding a new approach using dry processes to leverage the reliability of our equipment and various know-how cultivated through sales performance, applying its advantages to other markets (such as the battery market and particles) alongside process applications. Our downstream-type high-density plasma source (electrode) processing section is isolated from the workpiece, preventing any electrical or physical damage to the workpiece, and eliminating the effects of ultraviolet light generated during plasma creation. This allows for the only clean processing (particle-free) possible with atmospheric pressure plasma equipment. By changing the added gases, we can selectively impart molecular functionality, enabling interface control according to various surface materials as a processing technology. This is an effective means for direct adhesion, adhesion of dissimilar materials, and enhancing the adhesion of stronger coatings. The processing width (plasma width) can uniformly handle from 100mm to 3000mm. We can also accommodate carbon fiber bundles and fiber bundle shapes, allowing for uniform processing even within the bundles. Additionally, we can handle the same processing for particles. We manufacture tabletop experimental devices of the downstream type, conduct spot-type device experiments (starting from 2.5 million yen), and also carry out on-site experimental sample work.
