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  5. Plasma surface treatment equipment
  6. Atmospheric pressure plasma device *Cumulative track record of over 1,200 units introduced.

Atmospheric pressure plasma device *Cumulative track record of over 1,200 units introduced.

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Precise Series

last updated:Nov 13, 2024

イー・スクエア
イー・スクエア
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Development, manufacturing, and sales of atmospheric pressure plasma devices with a cumulative record of over 1,200 units (2021)! Atmospheric pressure plasma devices capable of generating high-density plasma.

E-Square Co., Ltd. was established in August 1999 with the aim of contributing to the global environment by applying plasma removal technology to eliminate PFCs (perfluorocarbons) emitted during IC manufacturing and other processes. In October 2001, the company began developing a surface modification treatment device utilizing atmospheric pressure plasma equipment. Experiments on resist stripping using atmospheric pressure plasma led to the development of a surface modification device widely used in LCD manufacturing processes. In August 2002, the surface treatment device was completed, which also became a turning point for entering the coating, film, and printed circuit board industries. E-Square has developed, manufactured, and sold the atmospheric pressure plasma surface treatment device 'Precise II,' which is ultra-compact, lightweight, highly reliable, and capable of generating high-density plasma, achieving cumulative sales of over 1,200 units (as of 2021). [Features] - Newly upgraded Precise series - Superior modification performance compared to competitors (high-density plasma generation) - Damage-free and particle-free - Ultra-compact and lightweight (Precise series) For more details, please contact us or download the catalog.

    Plasma surface treatment equipment
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Atmospheric pressure plasma device *Cumulative track record of over 1,200 units introduced.

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  • Related Link - http://www.e2-square.co.jp/products/index.html

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**Advantages of Atmospheric Pressure Plasma Surface Modification** - Ability to control the desired surface energy (contact angle) - Treatment can reach detailed areas of the active species gas (such as OH radicals) - Can be easily used as a plasma source for water-repellent, reduction treatment, etching, and CVD equipment by adding various gases - The equipment is compact (space-saving) - No post-treatment required for exhaust gases in hydrophilic treatment - No physical damage to the treated surface (downstream type) - No charge accumulation after treatment (downstream type) - No change in device performance even when treating semiconductor devices - No UV damage to the surface during treatment - No particle generation (downstream type) - Room temperature surface drying without residue - Addition of gas species allows for the incorporation of covalent molecules suitable for matrix materials - Direct adhesion technology for various films using molecular bonding

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Please contact us. Various tabletop experimental devices (plasma width 100mm and above) are available for on-site experiments.

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Atmospheric Pressure Plasma Surface Treatment Device "Precise Series"

Atmospheric Pressure Plasma Surface Treatment Device "Precise Series"

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[Data] Advantages of Atmospheric Pressure Plasma Surface Modification and Its Equipment ver: 2

[Data] Advantages of Atmospheric Pressure Plasma Surface Modification and Its Equipment ver: 2

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イー・スクエア

イー・スクエア

Electronic Components and Semiconductors

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We are expanding a new approach using dry processes to leverage the reliability of our equipment and various know-how cultivated through sales performance, applying its advantages to other markets (such as the battery market and particles) alongside process applications. Our downstream-type high-density plasma source (electrode) processing section is isolated from the workpiece, preventing any electrical or physical damage to the workpiece, and eliminating the effects of ultraviolet light generated during plasma creation. This allows for the only clean processing (particle-free) possible with atmospheric pressure plasma equipment. By changing the added gases, we can selectively impart molecular functionality, enabling interface control according to various surface materials as a processing technology. This is an effective means for direct adhesion, adhesion of dissimilar materials, and enhancing the adhesion of stronger coatings. The processing width (plasma width) can uniformly handle from 100mm to 3000mm. We can also accommodate carbon fiber bundles and fiber bundle shapes, allowing for uniform processing even within the bundles. Additionally, we can handle the same processing for particles. We manufacture tabletop experimental devices of the downstream type, conduct spot-type device experiments (starting from 2.5 million yen), and also carry out on-site experimental sample work.

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