We will recover the damaged mobile memory device physically.
At K-All, we also perform data recovery work on mobile phones and devices that have been physically destroyed and deemed irreparable by the manufacturer. By applying rework and reballing techniques, we can physically recover data from damaged mobile phones and memory devices. We can also handle devices with underfill. 【Features】 - Data recovery from physically destroyed mobile phones and devices - Recovery from intentionally destroyed mobile phones is also possible - Data recovery within devices using underfill BGA rework technology - Application of rework and reballing techniques - Support for devices with underfill For more details, please contact us or download the catalog.
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basic information
【Case Studies】 [Want to recover data from a destroyed mobile phone (case from a government agency)] ○ The task of removing the memory from a destroyed mobile phone and transferring it to the motherboard of the same model has been requested by many local governments and public agencies. ○ Although the work is difficult due to underfill being applied to the printed circuit board, recovery is possible if the memory component inside is not damaged. 【If you have similar concerns, please consult us】 ○ I want to salvage a faulty board that has a BGA with underfill processing. ○ I want to remove the BGA with underfill processing and analyze it. ○ I want to recover data from a broken mobile phone or mobile device. ● For more details, please contact us or download the catalog.
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Company information
Our company was founded in 1990 with four members. At the time of our establishment, we had no equipment, and each of us primarily worked on renovation projects and manual assembly with just a soldering iron. As the miniaturization of components progressed and the number of prototype and development projects involving BGA increased, so did the demand for BGA reballing and jumper wiring. Therefore, we introduced BGA rework equipment before implementing basic devices such as reflow ovens. Since then, we have conducted extensive research in technology alongside numerous customers, and we take pride in having established a level of reliability that satisfies our clients, not only for BGA but also for LGA, POP, underfill applications, and 0402 chip mounting. Other features of our company include the establishment of a RoHS-compliant factory, maintaining a constant inventory, and providing mounting support for cut parts (My Data), which differentiates us from other companies in the same industry. It is our mission to respond to all QCD (Quality, Cost, Delivery) requirements necessary for development and prototype assembly, and we are committed to providing technical support with customer satisfaction as our top priority.
