Supports high multi-layer and large current substrates! Leave the challenging substrate mounting to us.
Kei-Oll's special substrate mounting supports difficult-to-specify substrate implementations such as high-layer, high-current substrates, flexible substrates, and aluminum substrates. For the mounting of special substrates and components for which spares cannot be prepared, prior arrangements are extremely important. We will propose optimal solutions regarding temperature conditions and mounting methods. In particular, we have accumulated know-how on profiles suitable for various types of substrates. 【Features】 ○ Special substrates are our specialty! ○ Supports various substrates → Multi-layer substrates, aluminum core substrates, large substrates, thick substrates, thin substrates, irregularly shaped substrates, etc. ○ Adequate and safe profiles with abundant know-how ○ Proposes optimal solutions regarding temperature conditions and mounting methods For more details, please contact us or download the catalog.
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basic information
[Case Studies] [Struggling with the implementation of thick substrates] ○ Mounting high-cost devices on a 3.2mm thick substrate ○ Installing dummy ICs of the mounted devices on the profiling substrate to conduct profiling, examining the actual measurements of the device body and ball section, and extracting optimal temperature conditions ○ Achieving a mounting method that applies sufficient heat to both the substrate and the device while minimizing the thermal load on the device, successfully completing prototype evaluation ○ In recent years, the implementation of high-cost devices has increased, and in situations where spare devices cannot be easily prepared, promising maximum effectiveness at minimal cost * At Kei-All, it is mandatory to conduct initial temperature profiling in the presence of customers and the quality control department before implementation regarding special substrate mounting. * For DIP components with insufficient lead length, continuity checks are performed on all lead terminals. [Want to implement on an oversized substrate (1m square external dimensions) that cannot be fed into the reflow mounter] ○ All mounted components are handled with manual soldering * As this is a lead-free compliant product, it required high-level skills, but was delivered with zero defects. ● For more details, please contact us or download the catalog.
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Company information
Our company was founded in 1990 with four members. At the time of our establishment, we had no equipment, and each of us primarily worked on renovation projects and manual assembly with just a soldering iron. As the miniaturization of components progressed and the number of prototype and development projects involving BGA increased, so did the demand for BGA reballing and jumper wiring. Therefore, we introduced BGA rework equipment before implementing basic devices such as reflow ovens. Since then, we have conducted extensive research in technology alongside numerous customers, and we take pride in having established a level of reliability that satisfies our clients, not only for BGA but also for LGA, POP, underfill applications, and 0402 chip mounting. Other features of our company include the establishment of a RoHS-compliant factory, maintaining a constant inventory, and providing mounting support for cut parts (My Data), which differentiates us from other companies in the same industry. It is our mission to respond to all QCD (Quality, Cost, Delivery) requirements necessary for development and prototype assembly, and we are committed to providing technical support with customer satisfaction as our top priority.