Introduction to BGA Rework and Reballing! We are sharing our expertise with over 30,000 rework cases of BGA with a pitch of 0.4 to 0.8mm!
In this document, we introduce the functions of rework and reballing equipment, including BGA rework and reballing. Our company offers BGA replacement, BGA repair, BGA rework, BGA reballing, circuit board modification, circuit board repair, soldering services, and X-ray inspection services with CT functionality. Details of our "BGA Rework and Reballing" include over 30,000 rework achievements for BGA with a pitch of 0.4 to 0.8mm, as well as over 20,000 reballing achievements for BGA with ball diameters ranging from Φ0.2 to 0.8mm. We can also accommodate copper core balls. We can handle requests starting from one piece, and we are capable of working on circuit boards with underfill applied, as well as replacement work for QFN and connectors. Prices are clearly stated, so please feel free to contact us. [Contents] ■ What is rework? ■ What is reballing? ■ The technical capabilities of Viola that meet diverse needs ■ Introduction to some functions of Viola's rework and reballing equipment *For more details, please refer to the PDF document or feel free to contact us.
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basic information
[BGA Reballing Procedure] 1. IC Removal 2. Residual Solder Removal 3. Solder Paste Printing 4. Solder Ball Placement 5. Heating with IR Heater *For more details, please refer to the PDF document or feel free to contact us.
Price information
Estimated labor costs for parts replacement (rework) BGA: 3,500 yen to 8,000 yen Module: 3,500 yen to 8,000 yen QFN: 1,500 yen to 4,000 yen FET: 800 yen to 2,000 yen QFP/SOP: 500 yen to 3,000 yen Estimated labor costs for BGA reballing Up to 5 units: 4,000 yen per unit 6 to 9 units: 3,500 yen per unit 11 to 19 units: 3,000 yen per unit *The prices above are excluding tax.
Price range
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Delivery Time
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Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
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Company information
The impetus for our work on BGA rework was "environmental protection." Starting around 2002, we began to see a significant number of circuit board repairs that were impossible to fix while conducting mobile phone repair operations. When BGA (IC) was incorporated into mobile phones, adhesive (underfill) was used as a measure to prevent solder peeling. This adhesive reinforces the bonding between the circuit board and the IC, but due to aging and usage conditions such as drops, it can surprisingly crack easily. Later, these cracks can erode the solder of the IC, leading to functional failures. Since mobile phone circuit boards have many functions, the disposal cost for a single unit can be enormous. If IC replacement becomes possible, repairs can be conducted with just the cost of the IC and its replacement, allowing other components to be reused, which we believe connects this recycling technology to "environmental protection." Our company has been committed to creating a more environmentally friendly world through circuit board modification, repair, BGA reballing, and component regeneration long before the term SDGs became widely recognized, emphasizing the importance of the global environment.