Detailed information about the BGA rework system with a global cumulative sales volume of 7,000 units.
This is an introduction document for the IR method BGA rework systems "IR550A" and "IR/PL650A" owned by Viola Corporation. It covers issues related to lead-free rework using hot air, comparisons between hot air methods and ERSA IR heaters during BGA rework, and various advantages of infrared heating. [Contents (excerpt)] ■ ERSA IR/PL IR Rework Station ■ Issues with lead-free rework using hot air ■ Comparison of hot air methods and ERSA IR heaters during BGA rework ■ Advanced technology from ERSA ■ RPC Reflow Observation Camera ■ Various advantages of infrared heating, etc. *For more details, please refer to the PDF document or feel free to contact us.
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The impetus for our work on BGA rework was "environmental protection." Starting around 2002, we began to see a significant number of circuit board repairs that were impossible to fix while conducting mobile phone repair operations. When BGA (IC) was incorporated into mobile phones, adhesive (underfill) was used as a measure to prevent solder peeling. This adhesive reinforces the bonding between the circuit board and the IC, but due to aging and usage conditions such as drops, it can surprisingly crack easily. Later, these cracks can erode the solder of the IC, leading to functional failures. Since mobile phone circuit boards have many functions, the disposal cost for a single unit can be enormous. If IC replacement becomes possible, repairs can be conducted with just the cost of the IC and its replacement, allowing other components to be reused, which we believe connects this recycling technology to "environmental protection." Our company has been committed to creating a more environmentally friendly world through circuit board modification, repair, BGA reballing, and component regeneration long before the term SDGs became widely recognized, emphasizing the importance of the global environment.
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