COM Express【Express-SL/SLE】

PICMG (PCI Industrial Computer Manufacturers Group) is in the final stages of developing the latest COM-HPC computer-on-module specification to meet the needs of the highly advanced industrial edge computing market. The COM-HPC specification is intended not to replace COM Express but to expand upon its success, with a release planned by the second quarter of 2020. Edge computing is a rapidly growing field that demands unprecedented levels of performance. The system memory requirements for current and future high-end embedded multicore processors are increasing very sharply. As memory requirements approach 128 GB or 256 GB, current common form factors like COM Express can no longer provide a cost-effective solution. This is why COM HPC is needed. Five sizes have been defined that can be used as server modules capable of accommodating up to eight DIMM sockets onboard.

A new COM (Computer On Module) has been announced that adopts the 6th generation Intel Core i7/i5/i3 processors and the latest Xeon processors. These new modules are designed based on principles of optimal flexibility for upgrades and application scalability, enabling rapid development and market introduction of embedded applications.

On September 30, 2015, ADLINK Technology, a leading global provider of cloud-enabled services for edge devices that realize the Internet of Things (IoT), intelligent gateways, and embedded building blocks, announced the first 14 products featuring the 6th generation Intel Core i7/i5/i3 processors (code name Skylake) and the latest Xeon processors, which are set to be launched in the market in late 2015 and early 2016. These latest Intel processor-based products utilize cutting-edge 14nm microarchitecture and support ultra HD 4K resolution displays. ADLINK's new products include COM Express computer-on-modules in both compact and basic sizes, fanless embedded computers, and Mini-ITX and ATX industrial motherboards.