COM-HPC: Latest PICMG Computer-on-Module for High-Performance Edge Computing

PICMG (PCI Industrial Computer Manufacturers Group) is in the final stages of developing the latest COM-HPC computer-on-module specification to meet the needs of the highly advanced industrial edge computing market. The COM-HPC specification is intended not to replace COM Express but to expand upon its success, with a release planned by the second quarter of 2020.
Edge computing is a rapidly growing field that demands unprecedented levels of performance. The system memory requirements for current and future high-end embedded multicore processors are increasing very sharply. As memory requirements approach 128 GB or 256 GB, current common form factors like COM Express can no longer provide a cost-effective solution. This is why COM HPC is needed. Five sizes have been defined that can be used as server modules capable of accommodating up to eight DIMM sockets onboard.

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COM-HPC: Latest PICMG Computer-on-Module for High-Performance Edge Computing