Heating and cooling experiments can be conducted while suctioning! A vacuum chuck that achieves low cost.
The "Hot Vacuum Chuck (HoVaC)" integrates functionality while achieving low cost. It allows for consistent and stable heating and cooling across the entire porous working surface, enabling strong adhesion of the workpiece. It can be used for electrical durability tests of wafers while heated. 【Features】 ○ Ideal for durability tests with repeated heating and cooling ○ Simple structure that only requires screwing in the porous chuck ○ Compatible with round types of 6, 8, and 12, and square types of 150, 200, and 250 For more details, please contact us or download the catalog.
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basic information
【Capabilities】 ○ Heating up to 250°C on the porous surface is possible ○ Cooling (air cooling or water cooling) is also possible, in addition to heating ○ Heating can be done while maintaining adsorption ● For more details, please contact us or download the catalog.
Price information
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Delivery Time
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Applications/Examples of results
【Applications】 ○ Electrical durability testing of heated wafers ○ Semiconductor manufacturing processes in a vacuum ○ Wafer-level bonding ○ Wafer bonding technology using thermal curing ● For more details, please contact us or download the catalog.
Company information
We will shape "what you want" through conversations with our customers. Even if you cannot create a drawing, our staff will create the drawings while listening to your ideas. Our company has a comprehensive system in place from design to manufacturing and delivery.
![[Free Adhesion Test in Progress] Robot Transport Using Electrostatic Chuck](https://image.mono.ipros.com/public/product/image/f54/2000597250/IPROS45410531793134543182.jpeg?w=280&h=280)
