It is a device for applying a solution by spin coating.
This machine is a device that applies a solution to a silicon wafer by spin coating and dries it with a near-infrared lamp.
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basic information
- The control panel is handheld and can be moved in all four directions of each work surface of the device. - Two cassettes can be set on both the loader side and the unloader side. - The spin section has a maximum rotation speed of 6,000 rpm, and the rotation speed can be controlled in three stages by program. -Baking is done using a near-infrared lamp.
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Applications/Examples of results
We are receiving orders from various industries.
Company information
☆Dedicated Semiconductor Website Now Open!! https://www.wafer-measurement-inspection.com/ At Justem Co., Ltd., we design, manufacture, and sell automation and labor-saving machines for the wafer manufacturing process, including non-contact thickness measurement machines for wafers, wafer thickness sorting machines, automated lapping and polishing machines, and wafer transfer machines, targeting materials such as Si, SiC, and sapphire, through our unique technology development. We have provided these to many customers. We also design, manufacture, and sell specialized machines for electronic component processing and automotive parts processing. We also accept demo measurements for thickness measurement of various materials.
