It is a device for cleaning wafers that are epoxy bonded to a glass plate.
- Ultrasonic, oscillation, and nozzle cleaning remove dirt such as slurry from the workpiece. - The front and rear stroke of the nozzle can be adjusted according to the length of the workpiece. - The program can be set up to 10 steps.
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☆Dedicated Semiconductor Website Now Open!! https://www.wafer-measurement-inspection.com/ At Justem Co., Ltd., we design, manufacture, and sell automation and labor-saving machines for the wafer manufacturing process, including non-contact thickness measurement machines for wafers, wafer thickness sorting machines, automated lapping and polishing machines, and wafer transfer machines, targeting materials such as Si, SiC, and sapphire, through our unique technology development. We have provided these to many customers. We also design, manufacture, and sell specialized machines for electronic component processing and automotive parts processing. We also accept demo measurements for thickness measurement of various materials.
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