Composition analysis of 30nm size is possible without processing.
AES analysis is a method for obtaining compositional information from the surface down to a depth of several nanometers, and it is an effective analysis for investigating the composition of contaminants and foreign substances that occur on the surface during the manufacturing process. Since it rarely detects information about the substrate or base material, it allows for a simple examination of only the abnormal areas, such as foreign substances, without preprocessing. Additionally, by conducting surface analysis, it is possible to obtain elemental distribution images. In this case study, we will present data evaluated using AES analysis regarding foreign substances present on a Si wafer.
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For detailed data, please refer to the catalog.
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Applications/Examples of results
Analysis of LSI, memory, electronic components, manufacturing equipment, and parts.
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Download All Catalogs![[Analysis Case] Analysis of Microscopic Foreign Substances on Wafer Surface_C0334](https://image.mono.ipros.com/public/catalog/image/01/9a8/334992/IPROS99788356396363846910.jpeg?w=120&h=170)
Company information
MST is a foundation that provides contract analysis services. We possess various analytical instruments such as TEM, SIMS, and XRD to meet your analysis needs. Our knowledgeable sales representatives will propose appropriate analysis plans. We are also available for consultations at your company, of course. We have obtained ISO 9001 and ISO 27001 certifications. Please feel free to consult us for product development, identifying causes of defects, and patent investigations! MST will guide you to solutions for your "troubles"!