Linear Glass Scribbler LGS30

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LGS30

last updated：Apr 10, 2016

精密工業

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The specification is a scribing accuracy of 30 microns (30μm).

To break glass or silicon wafers, it is necessary to create scratches on the surface. This device can precisely create scratches using a super-hard wheel blade. The precision of the scratching is 30 microns (30μm).

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basic information

To break glass or silicon wafers, it is necessary to create scratches on the surface. This device can precisely create scratches with a super-hard wheel blade. The precision of the scratching (kegaki) is 30 microns (30μm). First, use the attached microscope to find the area where you want to create the cross-section. After that, use the blade attached to the linear guide to make the scratches. After scratching, break it with pliers.

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Applications/Examples of results

To break glass or silicon wafers, it is necessary to make scratches on the surface. This device can precisely make scratches with a carbide wheel blade. The precision of the scratching is 30 microns (30μm). First, you look for the area where you want to create a cross-section using the attached microscope. After that, you make the scratches with the blade attached to the linear guide. After making the scratches, you break it with pliers.