Adopting PLC control with high design flexibility! A polishing machine that achieves high throughput.
"Cyrex" is a fully automatic polishing machine equipped with a 1-stage grinding stone plus polishing, 4 stages of lapping, an automatic dressing mechanism for the grinding stone, and a grinding amount adjustment mechanism as standard features. It achieves high throughput through simultaneous polishing at each stage. Each stage is equipped with a cleaning tank and drying tank as standard, preventing the transfer of foreign substances from previous processes. It can flexibly accommodate various customizations. 【Features】 ○ High design flexibility with PLC control ○ Significantly increased productivity ○ Large 6-station polishing machine ○ Capable of stocking a large number of sample holders For more details, please contact us or download the catalog.
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basic information
【Main Specifications】 ○ Power Supply: Three-phase 200-220V 50/60Hz ○ Air: 0.5–0.7MPa (with filter and regulator) ○ Water: 0.2–0.4MPa, below 20L/min ○ Grinding Wheel Rotation Speed: 800–1700rpm (variable) ○ Grinding Wheel Diameter: φ355mm ○ Grinding Table Diameter: φ310mm *Compatible with a maximum of φ350mm ○ Grinding Table Rotation Speed: 60–350rpm (variable in 1rpm increments) ○ Sample Holder Diameter: φ160–200mm *Compatible with special-shaped holders ○ Sample Holder Rotation Speed: 60–200rpm (variable in 1rpm increments) ○ Pressure Force: 60–600N (variable in 1N increments) ○ Number of Grinding Condition Memories: 28 types (PLC control) ○ External Dimensions/Weight: W6325×D1545×H1900mm, approximately 5000kg ● For more details, please contact us or download the catalog.
Price information
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Delivery Time
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Applications/Examples of results
【Purpose】 ○ For sample observation under a microscope ● For more details, please contact us or download the catalog.
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Company information
Since our establishment, we have accumulated technology and know-how as a precision polishing manufacturer in the semiconductor and liquid crystal industries. Leveraging that know-how, we supply precision polishing equipment not only for metal precision polishing but also for semiconductor wafer polishing, compound semiconductor polishing, semiconductor and liquid crystal panel polishing, shaft polishing, sample polishing, and other industries. Being a Japanese product, and specifically made in Wakayama Prefecture, we offer specifications that cater to specific needs. Because we handle design, electrical, materials, manufacturing, and sales all in-house, we can flexibly accommodate custom specifications. In addition, in our control division, we provide maintenance and equipment modifications for existing customer equipment, as well as PLC replacements, utilizing the technology developed through our equipment development. We are dedicated to a customer-first philosophy, striving to improve without being confined to our own designed equipment or specific fields. If you have any polishing concerns, please reach out to IMT first.
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![[Patent] Achieving an air nozzle that completely removes water with air blow.](https://image.mono.ipros.com/public/product/image/4a3/2001469775/IPROS10759201048286602239.png?w=280&h=280)
![[Patent] Achieving an air nozzle that completely removes water with air blow.](https://image.mono.ipros.com/public/product/image/2116982/IPROS16998950562973190030.png?w=280&h=280)