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  6. Technical Introduction: "LED Brightness (High Brightness and Heat Dissipation Technology)"

Technical Introduction: "LED Brightness (High Brightness and Heat Dissipation Technology)"

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last updated:Oct 07, 2022

サトーセン
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Introducing LED brightness enhancement technology! It enables improved reflectivity and reduced junction temperature.

At Sato-Sen Co., Ltd., we have methods to improve the brightness of LEDs. One method involves enhancing the reflectivity, which can be achieved through the substrate, plating, and solder resist. Another method is to lower the junction temperature of the LED, which can be accomplished through pattern design, selection of heat dissipation materials, and setting conductor thickness. Additionally, it is also possible to improve brightness with our unique substrate shape. 【Features】 - Outer shape processing can be done through V-cut, routing, and press processing. - Thermal vias filled with copper paste allow for heat dissipation through through-holes. - Heat dissipation can also be achieved with heat sink pins inserted into through-holes. For more details, please contact us.

    Printed Circuit Board
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Technical Introduction: "LED Brightness (High Brightness and Heat Dissipation Technology)"

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  • Related Link - http://www.satosen.co.jp/technology/high-intensity…

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【Introduction to High Brightness and Heat Dissipation Technology】 ○ We propose optimal heat dissipation technology through abundant heat dissipation circuit design, high brightness, selection of heat dissipation materials, and plating techniques. ○ Regarding high brightness, the use of LED-specific white substrates and solder resist improves reflectivity, reducing discoloration due to thermal degradation during assembly and use. ○ We provide reflector processing for high brightness and optimal surface treatment for the wavelength of the LED. ○ We offer various heat dissipation measures to lower the junction temperature of the chip. ○ Substrates with contour processing:  → Metal base (aluminum, copper) printed circuit boards  → Heat dissipation CEM-3, heat dissipation FR-4, heat dissipation double-sided, heat dissipation multilayer printed circuit boards  → Heat dissipation metal-clad printed circuit boards  → Metal direct bonding printed circuit boards ● For more details, please contact us.

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サトーセン

サトーセン

Electronic Components and Semiconductors

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Sato-sen Co., Ltd. provides high-quality printed circuit boards that meet the increasing demands for high functionality and high precision, by proposing solutions to the concerns and problems of those involved in design, development, technology, and purchasing. Sato-sen offers customized, high-quality products and services tailored to various customer needs. As a partner company for our customers, Sato-sen delivers high added value throughout all processes, from design and development to production and delivery. Furthermore, by thoroughly adhering to a customer-first principle, we provide high-quality products and services with flexible and meticulous responsiveness, ensuring that customers receive what they want, when they want it.

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