Technical Introduction: "Heat Dissipation (High Brightness and Heat Dissipation Technology)"

Added to bookmarks
Bookmarks list

Bookmark has been removed
Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.
Free membership registration

last updated：Oct 07, 2022

サトーセン

Official site

Introducing heat dissipation technology! Heat dissipation is possible through pattern design, selection of heat dissipation materials, and setting conductor thickness.

At Sato-sen Co., Ltd., we propose optimal heat dissipation technologies for implementing devices with high heat generation. If it is necessary to lower the junction temperature of the mounted devices, heat dissipation can be achieved through pattern design, selection of heat dissipation substrates, and setting of conductor thickness. We also offer a wide variety of materials for substrates, including metal, CEM3, and multilayer heat dissipation materials. 【Features】 - Heat dissipation through thermal vias filled with copper paste in through-holes is possible. - Heat dissipation using heat sink pins inserted into through-holes is also possible. - Outline processing can be done using V-cut, routing, and pressing. For more details, please contact us.

Related Link - http://www.satosen.co.jp/technology/high-intensity…

Inquire About This Product

basic information

【Introduction to Heat Dissipation Technology】 ○ We propose optimal heat dissipation technology through extensive heat dissipation circuit design, high brightness, selection of heat dissipation materials, and plating techniques. ○ We offer various heat dissipation measures to lower the junction temperature of chips. ○ Substrates with external processing: → Metal-based (aluminum, copper) printed circuit boards → Heat dissipation CEM-3, heat dissipation FR-4, heat dissipation double-sided, heat dissipation multilayer printed circuit boards → Heat dissipation metal-clad printed circuit boards → Metal direct bonding printed circuit boards ○ For high brightness, dedicated white substrates for LEDs and solder resist improve reflectivity, reducing discoloration due to thermal degradation during assembly and use. ○ We provide reflector processing for high brightness and optimal surface treatment for the wavelength of LEDs. ● For more details, please contact us.