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  1. Home
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  3. Electronic Components and Modules
  4. Electronic Components
  5. Printed Circuit Board
  6. Technical Introduction: "Dust Prevention (Dust Emission Control Technology)"

Technical Introduction: "Dust Prevention (Dust Emission Control Technology)"

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last updated:Oct 07, 2022

サトーセン
サトーセン
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Introducing dust prevention technology for printed circuit boards! There are mass production results for optical systems thanks to dust collection technology.

At Sato-Sen Co., Ltd., we generally recommend dust-free router processing for the outer shape processing of optical devices that are sensitive to dust. Sato-Sen Co., Ltd. has a proven track record in mass production for optical systems through the optimization of router programs and dust collection technology during and after processing. 【Dust Prevention Technology】 - High-precision punching equipment and mold processing - Special mold heat treatment and surface treatment - High-precision assembly technology ⇒ Achieving finishes that closely rival traditional press molds with router processing. For more details, please contact us.

    Printed Circuit Board
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Technical Introduction: "Dust Prevention (Dust Emission Control Technology)"

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  • Related Link - http://www.satosen.co.jp/technology/burr.html

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【Technology Introduction】 ○ Circuit Formation → Achievements up to ±30μm ○ Gold Plating for Bonding → Over 25 years of experience with COB substrates ○ Silver Plating for Bonding → Capable of electroplating silver without electricity ○ Resin Leakage Prevention → Prevents resin leakage by permanently filling holes with epoxy ○ Dimensional Accuracy → Achievements up to ±50μm ○ V-Cut Position Accuracy → Achievements up to ±50μm ○ Counterboring → High-precision counterboring processing is possible ○ High Frequency → Impedance matching as per request is possible, enabling noise reduction ○ LED Brightness → Reflectivity can be improved through substrate, plating, and solder resist ○ Heat Dissipation → Heat dissipation is possible through pattern design, selection of heat-dissipating materials, and setting conductor thickness ○ Miniaturization → Miniaturization achieved with integrated rigid-flex printed circuit boards ○ Assembly → Easy-to-assemble pattern design implemented at the design stage ○ Magnetism → Magnetism can be reduced by selecting nickel plating solutions ○ Dust Prevention → Achievements in mass production for optical systems through optimization of router programs and dust collection technology during and after processing ● For more details, please contact us.

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サトーセン

サトーセン

Electronic Components and Semiconductors

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Sato-sen Co., Ltd. provides high-quality printed circuit boards that meet the increasing demands for high functionality and high precision, by proposing solutions to the concerns and problems of those involved in design, development, technology, and purchasing. Sato-sen offers customized, high-quality products and services tailored to various customer needs. As a partner company for our customers, Sato-sen delivers high added value throughout all processes, from design and development to production and delivery. Furthermore, by thoroughly adhering to a customer-first principle, we provide high-quality products and services with flexible and meticulous responsiveness, ensuring that customers receive what they want, when they want it.

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