Technical Introduction: "Improvement of V-Cut Position Accuracy (High-Density and Precision Processing Technology)"

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last updated：Oct 07, 2022

サトーセン

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Introducing technology for improving V-cut position accuracy! High-precision V-cut method using CCD.

At Sato-Sen Co., Ltd., we have achieved a positional accuracy of ±50μm through improvements in V-cut and pattern positioning. The pattern formation is made possible by the LDI (Laser Direct Imaging) method, and the V-cut is achieved using a high-precision V-cut method with CCD. We enhance hole position accuracy with ultra-high-speed micro-diameter drill machines, form high-density circuits (L/S = 30/30) with LDI, and provide high-density multilayer printed circuit boards with stable quality using X-ray reference drilling equipment and X-ray measuring machines. 【Features】 ○ We offer multilayer printed circuit boards → High density, IVH, BVH, and build-up with design flexibility ○ Flat plugs (pad-on-via) allow for mounting on through-holes ○ Landless through-holes enable compatibility with narrow pitch patterns ○ Ultra-fine printing is possible (1 character: vertical 0.28 × horizontal 0.15 mm) Please contact us for more details.

Related Link - http://www.satosen.co.jp/technology/board.html

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【Technical Introduction】 ○ Circuit Formation → Achievements up to ±30μm ○ Gold Plating for Bonding → Over 25 years of experience with COB substrates ○ Silver Plating for Bonding → Capable of electroless silver plating ○ Resin Leakage Prevention → Prevents resin leakage by permanently filling holes with epoxy ○ Dimensional Accuracy → Achievements up to ±50μm ○ V-Cut Position Accuracy → Achievements up to ±50μm ○ Counterboring → High-precision counterboring is possible ○ High Frequency → Impedance matching as per requirements is possible, reducing noise ○ LED Brightness → Reflectivity can be improved through substrate, plating, and solder resist ○ Heat Dissipation → Heat dissipation is possible through pattern design, selection of heat-dissipating materials, and setting conductor thickness ○ Miniaturization → Miniaturization with integrated rigid-flex printed circuit boards ○ Mounting → Easy-to-mount pattern design implemented at the design stage ○ Magnetism → Magnetism can be reduced by selecting nickel plating solutions ○ Dust Prevention → Mass production achievements in optical systems through optimization of router programs and dust collection techniques during and after processing ● For more details, please contact us.