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  6. Component Assembly Achievements

Component Assembly Achievements

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last updated:May 09, 2024

アレイ
アレイ
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We select the most suitable factory based on the implementation details in the array, so we can accommodate a wide range of requests.

BGA (0.4mm pitch), CSP (memory, diode) → Implementation X-ray inspection compatible double-sided BGA, 0402 size implementation.

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Component Assembly Achievements

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  • Related Link - https://www.array-net.com/column/rework

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【Features】 ○ Storage of implementation history and work-related documents ○ Clarification of interim inspection and final inspection items ○ Shape of fillet after soldering ○ Inserted components are formed with lead forming before implementation ○ Do not make independent judgments regarding questions or uncertainties discovered within the factory ● For more details, please contact us.

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BGA conversion board

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アレイ

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Manufacturing and processing contract

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Array Corporation has reached its 24th year since its establishment in 2001, thanks to your support. The strong desire to become a company that can be trusted by our customers, partner companies, and employees, which we have held since our founding, has not changed. This is also connected to the origin of the name "ARRAY." ARRAY is a term used in semiconductors, such as "Gate Array," but it also means "proper," "collection," and "beautiful." Moving forward, we aim to remain true to our original intentions and build trust with our customers through quality, aspiring to become a company that can provide the added value that emerges from that relationship. We look forward to your continued support.

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