Technical Introduction: "Improvement of Shape Accuracy (High-Density and Fine Processing Technology)"

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last updated：Oct 07, 2022

サトーセン

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Introducing technology for improving shape accuracy! High-precision shape processing tailored to patterns is possible.

At Sato-Sen Co., Ltd., we have achieved a positional accuracy of ±50μm in outline and pattern positioning. For pattern formation, we utilize the LDI (Laser Direct Imaging) method, and for outlines, we can perform high-precision outline processing tailored to the pattern using CCD technology. We improve hole position accuracy with ultra-high-speed micro-diameter drill machines, form high-density circuits (L/S = 30/30) with LDI, and provide high-density multilayer printed circuit boards with stable quality using X-ray reference drilling devices and X-ray length measuring machines. 【Features】 ○ We offer multilayer printed circuit boards → High density, IVH, BVH, and build-up with design flexibility ○ Implementation on through-holes is possible with flat plugs (pad-on-via) ○ Support for narrow pitch patterns with landless through-holes ○ Extremely fine printing is possible (1 character: vertical 0.28mm × horizontal 0.15mm) Please contact us for more details.

Related Link - http://www.satosen.co.jp/technology/board.html

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**Technical Introduction** ○ Circuit Formation → Achievements up to ±30μm ○ Bonding Gold Plating → Over 25 years of achievements in COB substrates ○ Bonding Silver Plating → Capable of electroplating silver without electricity ○ Encapsulation Resin Leakage → Possible to prevent resin leakage by permanently filling holes with epoxy ○ Dimensional Accuracy → Achievements up to ±50μm ○ V-Cut Position Accuracy → Achievements up to ±50μm ○ Counterboring → High-precision counterboring processing is possible ○ High Frequency → Impedance matching as per request is possible, reducing noise ○ LED Brightness → Reflectivity can be improved through substrate, plating, and solder resist ○ Heat Dissipation → Heat dissipation is possible through pattern design, selection of heat-dissipating materials, and setting conductor thickness ○ Miniaturization → Miniaturization with integrated rigid-flex printed circuit boards ○ Mounting → Easy-to-mount pattern design implemented at the design stage ○ Magnetism → Magnetism can be reduced by selecting nickel plating solutions ○ Dust Prevention → Achievements in mass production for optical systems through optimization of router programs and dust collection technology during and after processing ● For more details, please contact us.