Surface treatment device "Ultra-compact hoop plating device"

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last updated：May 17, 2016

イデヤ

Official site

Unique transport technology! Adopting serpentine and spiral methods, a high-performance surface treatment device even in ultra-compact size.

The "Ultra-Compact Hoop Plating Device" is a plating device that allows for long processing times in a single tank. By adopting a serpentine and spiral design, it achieves space-saving capabilities and can be installed in various locations, making it a cost-effective product. It can accommodate everything from hoop-shaped frames to wires. The unit's modular design allows for easy process changes. Additionally, a compact type is also available in the lineup. 【Features】 ○ Unique transport technology ○ Miniaturization through serpentine and spiral design ○ Easy process changes ○ Excellent cost performance For more details, please contact us or download the catalog.

Related Link - http://ideya.co.jp/?page_id=86

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basic information

【Specifications】 ■Production Capacity ・0.5m/min to MAX 10m/min ■Target Work Width ・max 100mm ■Target Work Thickness ・max 0.8mm [Further Miniaturization] ■Production Capacity: MAX 40m/min ■Strip Thickness ・0.05 to 0.8mm ■Target Work Width ・7 to 100mm ■Strip Material ・Copper alloy, brass, phosphor bronze, 42 alloy, SUS304 ■Target Plating ・Ni, Au, Ag, etc. 【Product Lineup】 ■Single-piece plating device ■Chill cup type plating device ■Unit type plating device ■Cell production plating processing device ■Wire plating device ●For more details, please contact us or download the catalog.