Unique transport technology! Adopting serpentine and spiral methods, a high-performance surface treatment device even in ultra-compact size.
The "Ultra-Compact Hoop Plating Device" is a plating device that allows for long processing times in a single tank. By adopting a serpentine and spiral design, it achieves space-saving capabilities and can be installed in various locations, making it a cost-effective product. It can accommodate everything from hoop-shaped frames to wires. The unit's modular design allows for easy process changes. Additionally, a compact type is also available in the lineup. 【Features】 ○ Unique transport technology ○ Miniaturization through serpentine and spiral design ○ Easy process changes ○ Excellent cost performance For more details, please contact us or download the catalog.
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basic information
【Specifications】 ■Production Capacity ・0.5m/min to MAX 10m/min ■Target Work Width ・max 100mm ■Target Work Thickness ・max 0.8mm [Further Miniaturization] ■Production Capacity: MAX 40m/min ■Strip Thickness ・0.05 to 0.8mm ■Target Work Width ・7 to 100mm ■Strip Material ・Copper alloy, brass, phosphor bronze, 42 alloy, SUS304 ■Target Plating ・Ni, Au, Ag, etc. 【Product Lineup】 ■Single-piece plating device ■Chill cup type plating device ■Unit type plating device ■Cell production plating processing device ■Wire plating device ●For more details, please contact us or download the catalog.
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What we sell are "things" and "services," that is, hardware and software. The hardware includes plating equipment and surface treatment equipment, of course. The software consists of improvement proposals, development, and corresponding experiments. We can accommodate inquiries regarding both aspects or just one of them. Our engineers in machinery, electrical, and chemical fields will respond to your requests!