イデヤ Product Lineup

This product is a compact automatic plating device that allows for manual experiments without the use of robots. Since each processing tank is integrated, it can easily accommodate changes in processes such as additions or replacements. Additionally, each processing tank can be equipped with options such as an overflow tank, cathode, and anode electrodes. Please consult us regarding high-temperature chemicals. 【Features】 ■ Suitable for small quantities of various types, experiments, and prototypes ■ Manual experiments are possible without using robots ■ Prototyping can be done using robots *For more details, please refer to the PDF materials or feel free to contact us.

• others

The "Ultra-Compact Hoop Plating Device" is a plating device that allows for long processing times in a single tank. By adopting a serpentine and spiral design, it achieves space-saving capabilities and can be installed in various locations, making it a cost-effective product. It can accommodate everything from hoop-shaped frames to wires. The unit's modular design allows for easy process changes. Additionally, a compact type is also available in the lineup. 【Features】 ○ Unique transport technology ○ Miniaturization through serpentine and spiral design ○ Easy process changes ○ Excellent cost performance For more details, please contact us or download the catalog.

• Plating Equipment

The "single-piece plating device" is a plating system that processes all workpieces one by one in a continuous manner, rather than in batch processing. Workpieces are individually cut from the loader and secured in work holders attached to a steel belt. The continuously operating steel belt then transports them through each process for plating. After processing, each piece is discharged to the unloader one by one. In short, it resembles a ski lift. This method ensures that all workpieces follow the same path, minimizing quality variations between them. This also affects the film thickness, so when the plating involves precious metals and is costly, it can lead to significant cost reductions. For more details, please contact us or download the catalog.

• Plating Equipment

The Chiru Cup-type plating device is a next-generation plating device that offers high plating efficiency compared to barrel plating, as there are no obstructions between the workpiece and the anode. Despite being media-free, it allows for plating in a short time. Power supply to the workpiece is conducted through a button-shaped cathode electrode installed at the bottom of the cup. It is also possible to automate processes including the front and back stages, using a robot to transport a basket containing the workpieces. 【Features】 ○ Media-free ○ No obstructions between the anode and workpiece ○ High plating efficiency ○ Adjustable cup tilt and rotation speed ○ Automation compatible For more details, please contact us or download the catalog.

• Plating Equipment