This is a batch-type ashing device that can be used for various process applications!
The "WPA800S" is a batch plasma ashing device with a coaxial barrel structure that accommodates 50 wafers. It supports wafer sizes of 200mm (8 inches) and can be used for various process applications such as low-damage ashing (ash removal) and surface modification by utilizing high-frequency plasma excitation on photoresist thin films formed on silicon wafers. 【Features】 ■ Coaxial barrel structure ■ 50-wafer batch type ■ Supports wafer size of 200mm (8 inches) ■ Easy recipe input *For more details, please refer to the catalog or feel free to contact us.
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【Specifications】 ■Main unit dimensions: Width (W) 850mm × Depth (D) 1,500mm × Height (H) 2,200mm ■Utilities ・Power supply: 200VAC (3-phase), 60Hz, 60A ・Process gas 1: O2/2,000sccm ・Dry air, purge gas (N2) ・Pump exhaust: 7,000L/min ■Wafer transport method ・Vertical operation cassette elevator ・Horizontal and rotary operation suction-type robot ・Wafer overhang and leftover detection function included ■Functions ・10-inch TFT color touch panel ・Sequencer ・Signal tower (3-light type) ■Options ・Dry pump for process chamber ・Additional process gas line can be added ・EPD system *For more details, please refer to the catalog or feel free to contact us.
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For more details, please refer to the catalog or feel free to contact us.
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Company information
Our company primarily engages in: 1. Sales and services of new equipment (plasma treatment equipment, wafer transporters (sorters), inspection equipment, etc.) 2. Sales and services of used semiconductor manufacturing equipment 3. Development, manufacturing, and consulting of equipment based on customer needs. Additionally, leveraging our network with companies both domestically and internationally, we accept inquiries regarding our customers' diverse needs, not limited to the semiconductor industry.
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