Single-wafer plasma etching processing device (single-wafer plasma etcher)
This device is a single-wafer plasma etching processing apparatus that performs treatments such as etching of polyimide-based resins and nitride films, as well as ashing (ash removal) of photoresists, using parallel plate high-frequency plasma. The operation panel allows switching between DP mode and RIE mode. It supports wafer sizes of 6 inches and 8 inches.
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basic information
This device is a single-wafer plasma etching processing system that performs etching of polyimide-based resins, nitride films, and ashing (ash removal) of photoresists using parallel plate high-frequency plasma. The operation panel allows switching between DP mode and RIE mode. It supports wafer sizes of 6 inches and 8 inches.
Price information
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Applications/Examples of results
Etching of materials such as SiO2, SiN, and Poly-Si (silicon wafers), as well as etching of polyimide-based resins. Ashing of photoresist. Improvement of adhesion effects through the removal of inorganic materials from CSP, BGA/CSP substrates, lead frames, etc. Surface modification of plastic packages, hybrid ICs, polymer materials, etc.
Company information
Our company primarily engages in: 1. Sales and services of new equipment (plasma treatment equipment, wafer transporters (sorters), inspection equipment, etc.) 2. Sales and services of used semiconductor manufacturing equipment 3. Development, manufacturing, and consulting of equipment based on customer needs. Additionally, leveraging our network with companies both domestically and internationally, we accept inquiries regarding our customers' diverse needs, not limited to the semiconductor industry.
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