Here are examples of processing zirconia used for parts that require high bending strength and are resistant to cracking.
Here are some examples of zirconia processing. Compared to alumina, which is also a metal oxide, it is difficult to manufacture large materials, and the material costs are higher. Therefore, it is often used for relatively small parts that require high bending strength and fracture toughness (resistance to cracking and chipping). 【Available Processing Sizes】 ■ Plate dimensions: φ350×30 mm ■ Round bar dimensions: φ50×300 mm ■ Groove: width 0.1 mm and above ■ Step (unevenness): up to 30 mm ■ Hole diameter: φ0.2 mm and above, etc. *For more details, please refer to the catalog or feel free to contact us.
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【Material Properties】 ■High Strength ・High bending strength and fracture toughness ・Resistant to chipping, cracking, and breaking ・Strong against impact ■Low Thermal Conductivity ・Low thermal conductivity, providing insulation effect ■Good Chemical Resistance ・Resistant to acids and alkalis ■Good Wear Resistance ・Tough and has good wear resistance *For more details, please refer to the catalog or feel free to contact us.
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Applications/Examples of results
【Applications】 ■ Parts subjected to large forces ■ Particularly resistant to impact ・Example: Ceramic knives ■ Insulating parts ■ Parts requiring wear resistance *For more details, please refer to the catalog or feel free to contact us.
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Since our founding in 2001, we have accumulated technology with the motto "We can process iron, and it's not impossible to process other materials." If you are facing challenges with materials such as alumina, zirconia, tungsten, or molybdenum and wondering, "Is there a way to process this material?", please feel free to reach out to us. We will propose the optimal materials tailored to your specific applications, ensuring short delivery times and high quality. We have introduced hot press machines and are working on direct bonding without the use of adhesives. Our precision machined parts are used in many industries, including semiconductor manufacturing equipment, aerospace, medical, precision instruments, analytical equipment, automotive, and nuclear power.