This introduces examples of processing silicon, which is the same material as the wafer used in semiconductor manufacturing.
Here are examples of silicon processing. In semiconductor manufacturing, silicon, which is of the same material as the wafer, is processed for applications that avoid contamination and particles. The material for columnar crystals (polycrystalline) is available in large sizes. Additionally, since columnar crystals are not single crystals, their workability for chipping, chipping, and cracking is good. 【Processing Example】 ■Product Name: Dome-shaped Electrode ■Material Used: Silicon ■Processing Method: Spherical Processing ■Size: φ60 ■Image sample is processed with a machining center for uneven surfaces. For more details, please refer to the catalog or feel free to contact us.
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【Available Sizes】 ■ Plate dimensions: 500×800×50 mm (columnar crystal) ■ Round bar dimensions: φ100×400 mm (columnar crystal) ■ Groove: Width 0.05～ mm ■ Unevenness: ～100 mm ■ Hole diameter: φ0.03～ mm ■ Hole depth: 20D (～φ1.5), 400 (φ1.5～) mm ■ Number of holes: ～5,000 ■ Screw: M3～ (Heli-Coil insertion required) *For more details, please refer to the catalog or feel free to contact us.
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Since our founding in 2001, we have accumulated technology with the motto "We can process iron, and it's not impossible to process other materials." If you are facing challenges with materials such as alumina, zirconia, tungsten, or molybdenum and wondering, "Is there a way to process this material?", please feel free to reach out to us. We will propose the optimal materials tailored to your specific applications, ensuring short delivery times and high quality. We have introduced hot press machines and are working on direct bonding without the use of adhesives. Our precision machined parts are used in many industries, including semiconductor manufacturing equipment, aerospace, medical, precision instruments, analytical equipment, automotive, and nuclear power.