Manufacturing method for thin CORELESS PCBs! Automatically loads DUMMY cores and PANELS.
The "Coreless Three-Layer Separator" is an automatic separation device for thin plates that corrects warpage and automatically loads/unloads. It is a manufacturing method for thin coreless PCBs that separates coreless products (3 to 5 layers) stacked on a dummy carrier substrate at the top and bottom. The panel sizes are 615 (L) × 510 (W) and 510 (L) × 415 (W) ±0.5mm. 【Main Equipment Structure】 ■ Loader/Unloader (Horizontal stacking or BOX or BOX + interleaving paper) ■ Panel Separation (#1, #2) ■ Panel Warpage Correction (#1, #2) - OPTION ■ Dedicated Trolley 2 units *For more details, please refer to the PDF materials or feel free to contact us.
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basic information
【Main Specifications】 ■Board Structure: CCL top/bottom (manual removal) ・Three-layer board composed of upper product + intermediate core + lower product ■Board SIZE: 405/415(L)*510(W) ±4mm ■Board THICKNESS ・Core Min 0.05mm to Max 0.12mm ・Product 0.04mm to 0.3mm ・Core Thickness must be more than 15% thicker than Top and Bottom Thickness ■Direction of Progress: Left -> Right or Right -> Left ■Tact Time ・110sec/2 pieces (55sec/1 piece) – Product upper and lower separation to WARPAGE correction ・50sec/2 pieces (25sec/piece) - Product upper and lower separation ■WARPAGE of calibrated products: Max 5mm (maximum bending height measured in a horizontal state on a flat plate) *For more details, please refer to the PDF document or feel free to contact us.
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Rat Corporation aims to be a company that satisfies its customers by leveraging its network with various electronic-related businesses both domestically and internationally to provide higher-level products and meet the diverse needs of its clients. For materials, equipment, manufacturing, and design of photomasks and printed circuit boards, trust Rat Corporation.