Auto-pillar horizontal device

Remove Mylar film using Pin and Air! No additional thickness adjustment is needed for each product.

This device is designed to automatically peel off a protective film (Polyester Film) that is tightly adhered to the surface in order to protect the dry film of printed circuit boards before the developing process. It uses a peeling method that employs pins and air to remove the Mylar film. There is no need for separate thickness adjustments for different products, and it allows for section settings tailored to the product size. Additionally, it is a system that does not require periodic replacement of consumables. 【Features】 - No separate thickness adjustments needed for different products - Section settings tailored to product size (3 levels) - A total of 18 film detection sensors (9 each for the upper and lower parts) installed to minimize the defect rate of unpeeled films - A system that does not require periodic replacement of consumables - Applicable range: Inner/Outer layer PCB & FPCB *For more details, please refer to the PDF document or feel free to contact us.

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