Solder alternative for aluminum components! High adhesion and low resistance! Conductive adhesive TCB series.
This is our unique conductive adhesive that uses silver-plated silica filler. [Features] 〇 Good conductivity… It adheres well to various materials and exhibits excellent conductivity. 〇 Excellent migration resistance… By reducing the amount of silver, the risk of migration is minimized. 〇 Lightweight and inexpensive… By using inorganic materials for the core, it is a lightweight material with about one-third the specific gravity compared to silver.
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basic information
For detailed specifications, please refer to the published materials. In addition to the TCB series, which has excellent adhesion properties, we also offer the TCP series, which has excellent printability.
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Delivery Time
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Applications/Examples of results
Solder, as an alternative to silver paste. [Examples of use] Conductive adhesives, die bonding materials Conductive ink applications such as for lead wiring etc.
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Company information
Toyo Aluminum K.K. has been pursuing the potential of aluminum's functionality and design since its founding, developing useful products and contributing to society. By accurately responding to customer needs based on the characteristics of aluminum and research outcomes, we produce foil products tailored to applications in packaging, electronics, and daily necessities, as well as powder and paste products as high-performance materials, and solar cell-related products that consider the global environment. We have grown into a manufacturer that operates globally, not only in Japan but also in Europe, the Americas, China, and other Asian countries. Moving forward, we will leverage our unique core technology as a source of development strength, under the action policy of "Creating the future, I create, we all create," to meet customer demands and contribute to the development of a new society.
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