Low-temperature curing conductive adhesive "Muromac Bond H-220"
Two-component conductive adhesive that can cure from 50°C for bonding heat-sensitive components.
It is a two-component conductive adhesive that can cure at low temperatures starting from 50℃.
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basic information
For more details, please refer to the catalog or feel free to contact us.
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Applications/Examples of results
LED, die bonding of IC chips, crystal oscillators, etc.
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Company information
Since our founding during the Meiji era, we started with the manufacturing and sales of household medicines and have since expanded into a wide range of businesses. We are deeply committed to enhancing customer satisfaction and strive to provide high-quality products and services. Through our various business endeavors, we will work to deliver excitement and joy to our customers. ◆◆◆ Ion Exchange Resin Comprehensive Information Center ◆◆◆ https://ionexchange-info.com 【Head Office】 1-38-5 Shinkatsutachi, Omuta City, Fukuoka Prefecture, 836-0895 TEL 0944-41-2131 FAX 0944-41-2131 【Tokyo Branch】 5th Floor, Ryumeikan Main Building, 3-4 Kanda Surugadai, Chiyoda Ward, Tokyo, 101-0062 TEL 03-3526-4801 FAX 03-3526-4805 【Osaka Sales Office】 307 Shin-Osaka Nishiura Building, 2-7-38 Nishinomiya-hara, Yodogawa Ward, Osaka City, 532-0004 TEL 06-6393-0007 FAX 06-6393-0008 【Tsukuba Factory】 4219-2 Takadoso, Shimotsuma City, Ibaraki Prefecture, 304-0031 TEL 0296-43-7036 FAX 0296-43-6124
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