Excellent step coverage and precise film thickness control! High-quality film formation is possible.
The "AFALD-8" is an atomic layer deposition device that enables film formation with atom-level thickness control on complex three-dimensional structures. It allows for high-quality thin film deposition in milliseconds, achieving stable film formation with low damage. It features user-friendly software and highly flexible configuration options. 【Features】 ■ Step coverage ■ High precision thickness control ■ Pinhole-free ■ Low damage ■ Reduced raw material costs *For more details, please refer to the catalog or feel free to contact us.
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basic information
【Main Specifications】 ■ Maximum substrate size: Φ200mm ■ Equipment size (W×D×H): 600×1700×2060mm ■ Equipment weight: Approximately 700Kg ■ Reactor type: Plasma, thermal ■ Plasma method: CCP, 13.4MHz maximum 1000w ■ Number of precursors (metal precursors) installed: Up to 4 units ■ Number of reaction gas systems: Up to 3 systems (mass flow controller) ■ Maximum substrate heating temperature: 400℃ (set value) ■ Vacuum pump: Dry pump (chemical compatible type) ■ Hot wall: Standard equipment ■ Pipe heating: Standard equipment *Individual control available ■ Pressure control: Automatic pressure regulating valve *Individual control for each chamber available ■ Process gas trap: Standard equipment ■ User interface: PC/AT (personal computer) ■ Module controller: PLC ■ Utilities ・Power supply: Three-phase AC200V 50/60Hz 150A ・P-N2: 0.3–0.6MPa 10SLM ・P-O2: 0.3–0.6MPa 6SLM ・N2: 0.3–0.6MPa 65SLM ・Compressed air: 0.5–0.7MPa 15SLM *For more details, please refer to the catalog or feel free to contact us.
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Applications/Examples of results
【Usage】 ■ As an atomic layer deposition device *For more details, please refer to the catalog or feel free to contact us.
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Company information
JSW Afti Corporation has been developing based on ECR plasma deposition technology within the NTT Group since its establishment. It started as part of the Mitsui Engineering & Shipbuilding Group in September 2007, when the semiconductor and flat panel manufacturing equipment businesses of the group companies were integrated into our company. In April 2014, we began anew as part of the Japan Steel Works Group, consistently handling everything from development to manufacturing, sales, and after-sales service, contributing even more to the value creation for our customers. We will not only unleash the potential of the technological resources we have developed and accumulated so far but also focus on their improvement and the development of new technologies, striving through these efforts to realize a prosperous future for our customers, ourselves, and society.