Grinding device, etching line
The thin plate type grinding machine can use ceramic buffs, non-woven fabrics, and bristle brushes. It is widely used for circuit, printing, gold plating pretreatment, hole plugging removal in the Buil-up method, resin removal, deburring, and surface treatment after copper plating. (Currently using 60μm thickness, testing 40μm) It is an ideal device for various samples and mass production processes. Additionally, we also offer high-multilayer grinding machines, thin plate grinding machines, and SUS plate grinding machines. 【Usage Processes (Track Record)】 ■D/F Pretreatment ■DEBURRING For more details, please refer to the catalog or feel free to contact us.
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basic information
【Lineup】 ■Ultra-thin Plate Polisher TSG-104R/L-P ■High Multi-layer Polisher TSG-104R/L-N ■Thin Plate Polisher TSG-104R/L-T ■SUS Plate Polisher TSG-106/104R/L-S ■Flexible Polisher TSG-104R/L-F *For more details, please refer to the catalog or feel free to contact us.
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Applications/Examples of results
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Company information
Rat Corporation aims to be a company that satisfies its customers by leveraging its network with various electronic-related businesses both domestically and internationally to provide higher-level products and meet the diverse needs of its clients. For materials, equipment, manufacturing, and design of photomasks and printed circuit boards, trust Rat Corporation.