High-precision processing type High-precision etching line
Fine processing specifications, thin plate transport compatibility
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basic information
【Features】 ○ The fine nozzle arrangement and oscillation system provide uniform surface accuracy. ○ The upper etching is individually pressure-controlled for even higher precision. ○ Workpieces with a thickness of 50μm can be stably processed. ● For other functions and details, please download the catalog or contact us.
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◆Development, etching, stripping devices/cleaning devices for FPC ◆Development, etching, stripping devices/cleaning devices for COF ◆Development, etching, stripping devices/cleaning devices for FPD (TFT/PDP) ◆Cleaning devices for solar cells ◎Fine technology Fine results cannot be reproduced without a comprehensive design that combines nozzle arrangement, nozzle characteristics, oscillation, pressure adjustment, etc. ◎Thin plate transport technology Experience and proven results are essential for transporting thin plates without damage. The Ninomiya system has incorporated creativity and ingenuity to achieve reliable transport. ◎High reliability Devices designed to achieve a higher level can be used with confidence by our customers. The Ninomiya system does not compromise on device manufacturing.
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