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Semiconductor reuse

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BGA rework with underfill

last updated:Jun 24, 2025

ケイ・オール
ケイ・オール
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If you are having trouble with the delivery times of semiconductor ICs, please contact K-All.

●In an Era of Difficulty in Procuring Semiconductor Devices In recent years, it has become well-known that components such as semiconductor devices and connectors are difficult to procure due to issues like material shortages. There have been reports indicating that procurement can take several years, and we have heard the lamentations from our customers. At K-All, with 30 years of experience since our founding, we can safely remove necessary components from existing circuit boards thanks to our continuously refined assembly and rework technology! This enables us to procure hard-to-find components in a short time and at low cost! We offer a service that provides benefits to our customers. *For more details, please contact us or download the catalog!*

    Other semiconductors
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Semiconductor reuse

reusable_ic.png
reusable_ic.png 半導体再生.png 半導体再生2.png 半導体再生3.png 半導体再生4.png 半導体再生5.png 半導体再生6.png 半導体再生7.png
  • Special site - Product/service details - https://pr.mono.ipros.com/kei-all/product/

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basic information

●BGA, LGA, and QFN can be reused and repurposed. BGA devices can be re-balled after removal (both eutectic and lead-free are acceptable). We support a wide range of pitches from 1.27mm to 0.25mm narrow pitch, including irregular special pitches. ●Post-removal handling Electronic components after removal will be delivered after solder removal. We also accommodate delivery in a reel-wound state. Please feel free to consult us about your preferred delivery format. ●Feel free to consult us about any type of circuit board! At K-All, we can perform rework on large, high-layer circuit boards, as well as boards with moisture-proof coatings and devices with underfill applied. If you are wondering, "I have a board with the parts I want, but can the work really be done...," please consult us first. ●For more details, please contact us or download the catalog.

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Delivery Time

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Applications/Examples of results

■We can accommodate from one trial unit. While it is possible to reuse devices removed from other boards, some may feel uneasy about manufacturing using these components. We can first produce one to several units for you to evaluate the removed parts, and then consider the next steps. We hope you can experience our rework technology. Regarding mass production, we have a track record of regenerating up to 100,000 components. Of course, we conduct visual inspections on each individual part before delivery. ■Short lead time response We have rework personnel on-site to provide support. While many companies perform rework alongside assembly work, we can offer higher quality and shorter lead times for rework. We will also respond quickly to mass production requests. Please feel free to inquire about partial delivery requests. ●For more details, please contact us or download the catalog.

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Technical Document "Underfill BGA Rework Technology"

Technical Document "Underfill BGA Rework Technology"

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Semiconductor reuse

Semiconductor reuse

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Company Profile

Company Profile

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Excerpt of Prototype Parts Implementation Know-How

Excerpt of Prototype Parts Implementation Know-How

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Company information

ケイ・オール

ケイ・オール

Manufacturing and processing contract

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Our company was founded in 1990 with four members. At the time of our establishment, we had no equipment, and each of us primarily worked on renovation projects and manual assembly with just a soldering iron. As the miniaturization of components progressed and the number of prototype and development projects involving BGA increased, so did the demand for BGA reballing and jumper wiring. Therefore, we introduced BGA rework equipment before implementing basic devices such as reflow ovens. Since then, we have conducted extensive research in technology alongside numerous customers, and we take pride in having established a level of reliability that satisfies our clients, not only for BGA but also for LGA, POP, underfill applications, and 0402 chip mounting. Other features of our company include the establishment of a RoHS-compliant factory, maintaining a constant inventory, and providing mounting support for cut parts (My Data), which differentiates us from other companies in the same industry. It is our mission to respond to all QCD (Quality, Cost, Delivery) requirements necessary for development and prototype assembly, and we are committed to providing technical support with customer satisfaction as our top priority.

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