High-speed cutting processing is possible! A laser system dedicated to cutting and drilling reinforced glass.
The reinforced glass cutting and drilling device "GLASS LASER TC" is a specialized machine for cutting and drilling reinforced glass used in smartphones and tablet PCs. The processing area is 200mm x 200mm, and the processing cracks are below 100μm, with an average of below 60μm. 【Features】 ■ Processing range: 200mm x 200mm ■ High-quality processing ■ High-speed cutting ■ Minimal crack-free cutting For more details, please refer to the catalog or feel free to contact us.
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basic information
【Specifications】 ■ Processing Range: 200×200mm (customizable) ■ Processing Speed: 10sec@φ10mm, 2sec@φ0.1mm ■ Material Thickness: 0.1 to 4mm ■ Minimum Processing Radius: 0.1mm ■ Processing Crack: Average 60μm, below 100μm ■ Processing Target: DOL30 or below *For more details, please refer to the catalog or feel free to contact us.
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Applications/Examples of results
【Applications】 ■ OGS buttons, circular hole processing ■ Organic EL/LCD/TFT panel glass, etc. ■ Processing of reinforced glass for portable devices, etc. *For more details, please refer to the catalog or feel free to contact us.
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Company information
Delphi Laser Japan Co., Ltd. engages in equipment sales, equipment development, laser processing, maintenance, and more in the Japanese market. The headquarters, Delphi Laser, is a joint venture between China and Australia, focusing on the development, manufacturing, and sales of laser equipment applied in various high-end industries. In particular, devices equipped with ultraviolet lasers and ultrashort pulse lasers leverage the characteristics of laser microprocessing and are widely applied in the precision microprocessing fields of solar cells, LEDs, LCDs, touch panels, and more.