デルファイレーザージャパン Product Lineup

A "laser" refers to a laser device that amplifies light and emits a single wavelength. There are various types, including "CO2 (carbon dioxide) lasers," "DPSS (solid-state) lasers," and "fiber lasers." The advantages include the ability to process a wide range of materials, from hard materials like ceramics and metals to soft materials like rubber, fabric, and paper, using simple processing jigs. Disadvantages include that etching large areas, such as with ITO, can take a long time, and thick plate processing is not a strong suit. [Advantages] - Non-contact processing - Dry process - Ultra-fine processing - Extremely low thermal processing *For more details, please refer to the PDF document or feel free to contact us.

• Laser Components

The picosecond laser-equipped microprocessing system "ULTRA PIONEER" is equipped with an ultra-short pulse laser, primarily applied for precision microprocessing, especially high-quality fine drilling, cutting, and scribing. The ultra-short pulse laser can be applied to various material processing, accommodating metals, semiconductors, ceramics, glass, and a variety of polymer materials. Additionally, it enables processing with almost no thermal impact on the materials, allowing for fine processing of heat-sensitive materials. 【Features】 ■ High processing precision, long-term stability, long lifespan ■ Fine processing width, high quality, minimal thermal impact ■ Capable of processing round, oval, multi-tube shapes, and irregular patterns ■ Minimum hole diameter φ30um, maximum aspect ratio 1:20 *For details, please request materials or view the PDF data from the download.

• Other processing machines

The laser system "GLASS LASER HS" is a dedicated device for high-speed crackless cutting of glass. The processing area is a maximum of 2650mm x 750mm, and the processing speed is high at 500mm/s, with the outer shape cutting of a 4-inch panel taking only 5 seconds. The processing cracks are also below 10μm. 【Features】 ■ Processing area: 2650x750mm ■ High-quality processing ■ High-speed cutting ■ High-speed crackless cutting For more details, please refer to the catalog or feel free to contact us.

• Touch Panel
• Other processing machines

The reinforced glass cutting and drilling device "GLASS LASER TC" is a specialized machine for cutting and drilling reinforced glass used in smartphones and tablet PCs. The processing area is 200mm x 200mm, and the processing cracks are below 100μm, with an average of below 60μm. 【Features】 ■ Processing range: 200mm x 200mm ■ High-quality processing ■ High-speed cutting ■ Minimal crack-free cutting For more details, please refer to the catalog or feel free to contact us.

• Touch Panel
• Other processing machines

The thin film patterning device "FILM LASER" is specialized for thin film removal processing on various substrates such as glass and resin. Upon request, the maximum processing area size can be up to 800mm x 800mm, and it can accommodate fine patterns with a line and space of 20μm/20μm. It also supports roll-to-roll device integration. 【Features】 ■ Processing range: 800mm x 800mm (customizable) ■ Line & space: 20μm/20μm ■ Mass production speed: 5,000mm/s ■ Integration of roll-to-roll, loader, and unloader processing ■ Improved production efficiency through automatic cutting For more details, please refer to the catalog or feel free to contact us.

• Circuit board processing machine
• Touch Panel
• Etching Equipment

The ultraviolet wafer scribing device "ULTRA SCRIBER" is equipped with an LD-excited solid UV laser and is mainly applied for precision fine scribing of wafers. It features a 4-axis platform system with X-Y-Z-θ, where the X-Y stage has a stroke of 120mm and a resolution of 0.1μm. 【Features】 ■ Special V-shaped cutting edge ■ High efficiency through high-speed processing ■ Compatible with 4-inch wafers (expandable) ■ Automatic image recognition and positioning system For more details, please refer to the catalog or feel free to contact us.

• Wafer processing/polishing equipment
• Other semiconductor manufacturing equipment

The "P303 Picosecond Laser" is a picosecond laser that combines excellent beam quality, output stability, and a compact design. By integrating fiber laser technology with LD amplifiers, it achieves a pulse energy of over 200μJ, a pulse width of less than 15ps, and an average output of over 30W. 【Features】 ■ Repetition frequency: 150–1000kHz ■ Beam mode: TEM00 (M2 < 1.3) ■ Compact design ■ Equipped with RS232 and external GATE control ■ Assembled in a clean room environment class 1000 *For more details, please refer to the catalog. Feel free to contact us with any inquiries.

• Laser Components
• Other processing machines

The "UV Laser 10W" is a UV laser equipped with carefully selected LD pumps and wavelength conversion elements. With excellent beam mode and short pulse width, it enables high-quality fine processing. It can be used for cutting glass, sapphire processing, and fine hole drilling. *For more details, please refer to the catalog. Feel free to contact us as well.

• Other processing machines
• Laser Components

The "2-wavelength 4-optical-path laser processing machine" is a precision processing machine capable of pattering, cutting, and drilling using lasers. The movable folding total reflection mirror is soft and allows for switching between fixed optical system type and galvanometer type. The focusing lens holder is detachable and can be moved with a guide, while fine adjustments are made using a Z-axis motor. *For more details, please refer to the catalog. Feel free to contact us with any inquiries.

• Laser Components
• Other processing machines

This catalog is a comprehensive catalog of Delphi Laser Japan Co., Ltd., which primarily engages in equipment sales, equipment development, laser processing, and maintenance in the Japanese market. It features various laser processing equipment, including "ultra-short pulse laser fine processing equipment" used for high-quality fine hole drilling, "ultraviolet laser fine processing equipment," and "ceramic substrate laser processing equipment." We offer a wide range of products that can be used for various applications. [Contents] ■ Ultra-short pulse laser ultra-fine processing equipment ■ Ultraviolet laser fine processing equipment-D ■ Ultraviolet laser fine processing equipment-S ■ Ceramic substrate laser processing equipment ■ Light guide plate dot equipment, etc. *For more details, please refer to the catalog or feel free to contact us.

• Other processing machines