Processing cracks below 10μm! Special equipment for high-speed crack-free cutting of glass.
The laser system "GLASS LASER HS" is a dedicated device for high-speed crackless cutting of glass. The processing area is a maximum of 2650mm x 750mm, and the processing speed is high at 500mm/s, with the outer shape cutting of a 4-inch panel taking only 5 seconds. The processing cracks are also below 10μm. 【Features】 ■ Processing area: 2650x750mm ■ High-quality processing ■ High-speed cutting ■ High-speed crackless cutting For more details, please refer to the catalog or feel free to contact us.
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basic information
【Specifications】 ■ Processing Area: 2650x750mm ■ Processing Speed: 500mm/sec (4-inch mobile outline cutting in 5 seconds) ■ Material Thickness: 0.1 to 0.4mm ■ Processing Crack: Below 10μm ■ Processing Target: High-strength glass with DOL below 50μm *For more details, please refer to the catalog or feel free to contact us.
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Applications/Examples of results
【Applications】 ■ OGS outer shape cutting ■ Panel glass such as OLED/LCD/TFT ■ Lossless cutting of coated parts, etc. *For more details, please refer to the catalog or feel free to contact us.
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Company information
Delphi Laser Japan Co., Ltd. engages in equipment sales, equipment development, laser processing, maintenance, and more in the Japanese market. The headquarters, Delphi Laser, is a joint venture between China and Australia, focusing on the development, manufacturing, and sales of laser equipment applied in various high-end industries. In particular, devices equipped with ultraviolet lasers and ultrashort pulse lasers leverage the characteristics of laser microprocessing and are widely applied in the precision microprocessing fields of solar cells, LEDs, LCDs, touch panels, and more.
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