A semiconductor package that supports miniaturization and high density through unique cavity structure formation technology.
Our "Semiconductor Package (EBGA)" responds to miniaturization and high density through the adoption of unique cavity structure formation technology, fine pattern formation technology, and electroless gold plating technology. Using our proprietary method, we manufacture packages with a three-dimensional cavity structure. It is also possible to directly replace the cavity structure of a ceramic substrate with a glass-epoxy substrate. Furthermore, by implementing functional components in the cavity section, internal component embedding is possible. This allows for shorter signal propagation distances, making it effective for high-speed processing. 【Features】 ■ Unique cavity formation technology ■ Supports miniaturization and high density ■ Effective for high-speed processing ■ Can use the substrate surface as the mounting surface in combination with build-up ■ Produces high-speed processing packages by bonding metal heat spreaders *For more details, please refer to the catalog or feel free to contact us.
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【Structural Example】 ■ High-Density Formation of Multi-Layer Cavities - Achieved high-density formation of multi-layer cavities through cavity formation technology - Made it possible to shorten the bonding wire length to the extreme ■ Improved High-Speed Processing Performance - Formed cavities on the opposite side of the IC - Equipped with decoupling capacitors - Shortened the distance from the capacitor to the IC junction, reducing inductance and enabling high-speed processing *For more details, please refer to the catalog or feel free to contact us.
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【Usage】 High-speed processing package, etc. *For more details, please refer to the catalog or feel free to contact us.
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Company information
Japan Micron focuses on the manufacturing of printed circuit boards and provides development and design assistance for various types of boards, including sensor boards and module boards, as well as some assembly. Utilizing patents, proprietary equipment, and unique technologies, we achieve diverse functionalities such as high density, miniaturization, heat dissipation, thinness, high-frequency characteristics, energy efficiency, and three-dimensionality, ensuring high reliability and producing products that meet our customers' needs.