3D implementation contributes to miniaturization and high density.

We contribute to miniaturization of products through 3D implementation technologies such as PoP (Package on Package) implementation.

PoP technology is adopted in products that require miniaturization and high density, such as smartphones and digital still cameras, and our company has achieved a cumulative production record of over 100 million units to date. Additionally, we possess technologies for stacking substrates beyond PoP, enabling us to respond to product miniaturization. 【Features】 ■ By stacking two semiconductor packages, it is possible to reduce the footprint on the substrate. ■ By using wiring between the upper and lower packages, we can shorten the wiring length compared to wiring on the substrate, enabling high-speed wiring. ■ By using tested packages with guaranteed quality, we can reduce the failure rate compared to SiP. ■ We can also accommodate substrate stacking beyond PoP. *For more details, please refer to the PDF document or feel free to contact us.

Printed Circuit Board