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  1. Home
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  3. Scientific and Physics Equipment
  4. Surface Treatment Equipment
  5. Plasma surface treatment equipment
  6. No need to choose sample shapes, process freely! Barrel-type plasma treatment device.

No need to choose sample shapes, process freely! Barrel-type plasma treatment device.

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last updated:May 23, 2017

電子技研
電子技研
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Cleaning and modification of fine patterns and the inner surfaces of tube shapes are possible! Cleaning and modification can be done without using solutions, achieving good environmental performance and low running costs.

The barrel-type plasma treatment device "PB Series" utilizes isotropic vacuum plasma for the removal of organic materials (Ashing), removal of oil (Cleaning), etching of silicon compounds (SiO2, SiN), and improvement of wettability, all without the use of solutions (Wet). It achieves a good environmental performance (clean working environment, no waste liquid) and low running costs. Treatment progresses from all directions, demonstrating effects of nano-level processing, cleaning, and modification regardless of the shape of the target object. 【Device Features】 ■ Free processing that does not select sample shapes (cylindrical processing chamber / isotropic plasma) ■ Diverse processes: Ashing (cleaning), Etching, surface modification, etc. ■ All parts are compatible with clean room standards (can be used as semiconductor manufacturing equipment) ■ Cost-effective, small footprint design ■ Safe specifications suitable for mass production equipment For more details, please contact us or download the catalog.

    Plasma surface treatment equipment
denshi_pb.jpg

No need to choose sample shapes, process freely! Barrel-type plasma treatment device.

denshi_pb.jpg
denshi_pb.jpg
  • Related Link - http://www.denshigiken.co.jp/contents/seihin.html

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basic information

【Device Specifications】 ○ Device Footprint: Width 650 × Depth 800 × Height 1260 ○ Processing Chamber: φ300 × L450 Quartz Chamber ○ High-Frequency Oscillator: 13.56 MHz / 500 W ○ Processing Gas: Two systems of mass flow control for processing gas ○ Vacuum Exhaust: Dry Pump ○ Control: Auto/Manual operation microcontroller control ○ Safety Specifications: Emergency stop switch, various interlocks ○ Utilities: Power supply, processing gas, Dry Air, N2, cooling water ● For more details, please contact us or download the catalog.

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【Applications】 We respond to various needs in electronic components, powders, molds, medical fields, etc. - Etching of resist ashing, SiO2, SiN, etc. - Bump pre-treatment / UBM plating pre-treatment / Lead frame cleaning - Surface modification of metals, resins, etc. (hydrophilization / hydrophobization / reduction) and cleaning (organic matter removal) - Sterilization ● For more details, please contact us.

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Barrel-type reduced pressure plasma treatment device PB series (vacuum plasma device)

Barrel-type reduced pressure plasma treatment device PB series (vacuum plasma device)

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電子技研

電子技研

Industrial Machinery

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Focusing on plasma and vacuum-related equipment, we respond to a wide variety of needs in various fields, including cleaning equipment and material handling. We also flexibly accept contract manufacturing for OEMs and other products beyond our own. Regarding plasma processing, we conduct joint research and development with other companies and universities in various fields, including electronics and medical applications. We also accept contract processing only. Leveraging our position as a manufacturer in design and other areas, we offer maintenance services for factory equipment, contract maintenance from equipment manufacturers, relocation of existing equipment, and refurbishment of used equipment, providing maintenance for various devices regardless of whether they are our own or from other companies.

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