Various functional groups (hydrophilic, lipophilic, adhesion improvement, etc.) can be chemically bonded to various substrates and films according to their applications.
The "PC-RIE series" is capable of providing various surface modification effects on different substrates and films. Of course, it can also perform treatments such as ashing, etching, and descumming as a general plasma treatment device. You can choose a version that suits your needs, ranging from a manually operated research and development type chamber to a fully automated system with an atmospheric gate, transport mechanism, and cassette station. 【Features】 ○ Functional group modification treatment ○ Reactive Ion Etching (RIE) For more details, please download the PDF or contact us.
Inquire About This Product
basic information
Our headquarters is equipped with RIE devices for evaluation testing, and we accept process evaluation experiments at any time. We also provide technical presentations and consultations on plasma applications. For more details, please feel free to contact our sales department. 【Application Examples】 - Achieving direct copper plating on difficult-to-plate resins - Realizing adhesive-free bonding between resin and metal - Improving adhesive strength with adhesives - Removing smears after laser processing (desmear treatment) - Hydrophilizing fluorine-based resins and enhancing adhesion - Improving adhesion for soldering, bonding, and more For further details, please download our catalog or contact us.
Price range
Delivery Time
Applications/Examples of results
【Applications】 ○ Achieves direct copper plating on difficult-to-plate resins ○ Realizes adhesive-free bonding between resin and metal ○ Improves adhesion strength with adhesives ○ Smear removal after laser processing (desmear treatment) ○ Hydrophilization and improved adhesion of fluoropolymer resins ○ Enhances adhesion for soldering, bonding, etc. ● For more details, please contact us.
catalog(1)
Download All CatalogsCompany information
Focusing on plasma and vacuum-related equipment, we respond to a wide variety of needs in various fields, including cleaning equipment and material handling. We also flexibly accept contract manufacturing for OEMs and other products beyond our own. Regarding plasma processing, we conduct joint research and development with other companies and universities in various fields, including electronics and medical applications. We also accept contract processing only. Leveraging our position as a manufacturer in design and other areas, we offer maintenance services for factory equipment, contract maintenance from equipment manufacturers, relocation of existing equipment, and refurbishment of used equipment, providing maintenance for various devices regardless of whether they are our own or from other companies.