Insulating adhesive film for high-frequency, high-speed transmission FPC and rigid circuit boards

Thin films and high-insulation adhesive films that respond to the high-frequency, thin, and compact trends in semiconductors and passive components.

The "High Frequency and High-Speed Transmission FPC and Rigid Circuit Board Insulating Adhesive Film" is a product of Namix, which conducts research, development, manufacturing, and sales of electrochemical materials under the trademark "Adfrema." This film has excellent low dielectric constant and low dielectric loss tangent, making it ideal for high-frequency characteristics in the GHz range. It features good filling properties for uneven surfaces at low temperature and low pressure, and it can exhibit high adhesion and high heat resistance in its unreacted state as a thermosetting resin film. In addition to being used as an interlayer insulating material and build-up material for FPCs, it is also suitable as a MEMS structural material and process material, and it is compatible with laser and plating processing. 【Features】 - Low dielectric constant and low dielectric loss tangent - Thin layer insulation: 5 to 30 µm thickness - Excellent filling properties for uneven surfaces at low temperature and low pressure - Thermosetting resin film - Suitable for laser and plating processing *For more details, please refer to the PDF document or feel free to contact us.

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