High-purity insulating materials for the purpose of sealing semiconductor chips!
The "adhesive for camera modules" is an insulating adhesive that allows for a process with minimal shrinkage due to UV curing. It is intended for bonding and fixing applications that require high positional accuracy, as well as for bonding materials with low heat resistance. 【Features】 ■ Insulating material for encapsulating semiconductor chips ■ Curing by UV irradiation ■ Low-temperature curing ■ High reliability *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Lineup】 ■UV COAT 6919: UV + heat curing, low-temperature curing, high reliability *For more details, please refer to the PDF document or feel free to contact us.*
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【Usage】 ■ Adhesive for camera modules *For more details, please refer to the PDF document or feel free to contact us.
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Company information
Namix Corporation is a company engaged in the research, development, manufacturing, and sales of electrochemical materials. By refining the material technology cultivated since its founding and strengthening the development of new technologies, we propose products that realize our customers' potential needs.
