High-purity insulating materials for the purpose of sealing semiconductor chips!
The "Dam & Fill Material" is an insulating material primarily used for sharp dam formation in CSP/BGA and other wire bonding implementations, enabling smooth filling between wires for sealing. It boasts excellent moldability and is a highly reliable material that reduces package warpage. 【Features】 ■ Insulating material for encapsulating semiconductor chips ■ Sharp dam shape ■ Excellent moldability ■ Achieves reduction of package warpage ■ High reliability *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Lineup】 ■ Chip Coat G8345D: Sharp dam shape ■ Chip Coat G8345D-37: Sharp dam shape, fine filler ■ Chip Coat G8345-6: Low warpage, high fluidity ■ Chip Coat G8345-29: Low warpage, fine filler *For more details, please refer to the PDF document or feel free to contact us.
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【Purpose】 ■Sealing of semiconductor chips *For more details, please refer to the PDF document or feel free to contact us.
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Namix Corporation is a company engaged in the research, development, manufacturing, and sales of electrochemical materials. By refining the material technology cultivated since its founding and strengthening the development of new technologies, we propose products that realize our customers' potential needs.
