High-purity insulating material for the purpose of sealing semiconductor chips!
The "Low-Temperature Curing Adhesive" is a product of Namix, a trademark of "Chip Coat," which conducts research, development, manufacturing, and sales of electrochemical materials. This product is designed for high-precision bonding and fixing, as well as for bonding components with low heat resistance, and it is an insulating adhesive that can cure at temperatures below 100°C. 【Features】 ■ Insulating material for encapsulating semiconductor chips ■ Low-temperature curing type *For more details, please refer to the PDF document or feel free to contact us.
Inquire About This Product
basic information
【Lineup】 ■AH8455-345B: Low-temperature curing type *For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
【Purpose】 ■Sealing of semiconductor chips *For more details, please refer to the PDF document or feel free to contact us.
catalog（1）
Download All Catalogs
Company information
Namix Corporation is a company engaged in the research, development, manufacturing, and sales of electrochemical materials. By refining the material technology cultivated since its founding and strengthening the development of new technologies, we propose products that realize our customers' potential needs.