Introduction of the registered trademark "Unimec" heat-curing conductive materials.
"Dia Attach Agent" is a thermosetting conductive material that is versatile for various applications, including die bonding for bare chips, adhesion of LEDs, and bonding of electrodes and lead wires, as well as for high thermal conductivity. Our trademark "Unimec" is a conductive material that can be treated at low temperatures, made from a thermosetting resin primarily based on epoxy resin, with specially processed in-house conductive powder uniformly dispersed throughout. The development and blending of conductive powders enable the manufacture of products with various characteristics. [Features] ■ Versatile applications ■ Thermosetting conductive material ■ Can be treated at low temperatures *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Lineup】 ■H 9607: Compatible with all colors, good adhesion strength at high temperatures ■H 9863: Compatible with blue and white, good heat and light resistance ■H 9683: High thermal conductivity type, high adhesion strength, void-free ■H 9800: Bleed-free, good adhesion strength at high temperatures ■H 9870: Bleed-free, low elastic modulus ■Sk70N: High thermal conductivity type, high reliability ■H 9940: High thermal conductivity type, high reliability *For more details, please refer to the PDF document or feel free to contact us.
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Applications/Examples of results
【Applications】 ■ For die bonding of bare chips ■ For adhesive bonding of LEDs and electrodes to lead wires ■ For high thermal conductivity *For more details, please refer to the PDF document or feel free to contact us.
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Company information
Namix Corporation is a company engaged in the research, development, manufacturing, and sales of electrochemical materials. By refining the material technology cultivated since its founding and strengthening the development of new technologies, we propose products that realize our customers' potential needs.