Yunimec "Low-Temperature Sintering High Thermal Conductivity Die Attach Adhesive Using MO Technology"
Introduction of the registered trademark "Unimec" heat-curing conductive materials.
With the increasing density and integration of devices, high thermal conductivity materials are in demand. Additionally, Pb solder materials have not yet been established. Therefore, by using MO technology, we have developed a high thermal conductivity die attach that allows for low-temperature sintering. A thermal conductivity of 170 W/mK has been achieved, and the brittleness of the Ag sintered body has been improved through reinforcement with resin. We have samples available for provision, so please contact us for consultation. 【Features】 ■ Uses MO technology ■ Enables low-temperature sintering ■ Thermal conductivity of 170 W/mK ■ Samples available for provision *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Lineup】 ■H 9890-6A: High thermal conductivity type, high strength ■H 9890-6S: High thermal conductivity type, high strength ■H 9890-6: High thermal conductivity type, high strength *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Namix Corporation is a company engaged in the research, development, manufacturing, and sales of electrochemical materials. By refining the material technology cultivated since its founding and strengthening the development of new technologies, we propose products that realize our customers' potential needs.
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