Generate fine cracks with a diamond rotary cutter and split the substrate after firing.
The "Scriber" is a device that performs scribing processing on ceramic substrates after firing using a diamond cutter. It achieves high-speed (up to 500mm/sec) and high-precision (±30um) processing, allowing for the clean division of substrates without being affected by material loss or cutting fluid. 【Features】 ■ Generates fine cracks with a diamond rotary cutter to divide the substrate after sintering. ■ No cleaning process is required; division processing can be performed after component mounting. ■ Can be processed with high precision without being affected by shrinkage due to temperature changes during firing. *For more details, please refer to the PDF document or feel free to contact us.
Inquire About This Product
basic information
【Lineup】 ■S125-ald ・Maximum work size (mm): 125×125 ■S230 ・Maximum work size (mm): 230×230 *For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
【Target Work】 ■Ceramic substrate after firing *For more details, please refer to the PDF document or feel free to contact us.
catalog（1）
Download All Catalogs
Company information
What we deliver is Yamaha quality. Yamaha Fine Technologies' products embody the "technology" and "skills" that Yamaha has cultivated in instrument making. Interior parts that balance the warmth of wood with the quality of industrial products, and FA equipment that achieves the required functions and performance with high reliability. Both are the crystallization of Yamaha's manufacturing technology, which has widely delivered delicate products like musical instruments around the world. By merging the latest technology with artisan skills, we achieve exceptional quality. Yamaha Fine Technologies will continue to meet manufacturing expectations through the pursuit of refined technology.