There are cases where the drying time has been reduced to 1/3 to 1/4 due to miniaturization to 1/3 to 1/4! A "super compact furnace" suitable for drying various small lots.
The "WD-100 Series" is a drying oven designed to pursue space-saving and ease of setup. It accommodates substrate sizes from 50mm to 125mm and thicknesses from 0.2mm to 2mm. By maximizing the high-speed heating of the hot plate and optimizing the transport system, we have achieved high-speed transport and direct heating. It supports multi-size, high-speed transport, high-speed heating, and a low footprint. 【Features】 ■ Drying is up to 10 times faster compared to IR atmosphere ovens. ■ Idle time is reduced to as short as 1/20 compared to IR atmosphere ovens. ■ Clean with solvent recovery. *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Specifications】 ■Target Work: 50mm to 125mm ■Drying Method: Hot Plate Drying Method ■Capacity (Temperature) ・PID Control Method: Up to 200℃ ・Heater: 4 Zones ・Heating Time: 8 seconds to 10 minutes (MAX 213 minutes) ・Effective Heating Dimensions: L800mm × W150mm (200mm × 4ch) ■Capacity (Operation) ・Conveying Method: Walking Type with 3 Bars (Silicone Used on Contact Surface) (Upper and Lower Cylinders) ・Conveying Distance: 100mm/Pitch ・Conveying Speed: 10mm/s to 500mm/s ・Beam Outer Width: 88mm Pitch 42mm ■External Dimensions: W1200 × D200 × H165 ■Weight: 50kg ■Power Consumption: MAX 2.8kw Normal 500W *For more details, please refer to the PDF document or feel free to contact us.
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【Purpose】 ■ As a drying furnace for various types and small lots *For more details, please refer to the PDF document or feel free to contact us.
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Company information
Mec Corporation is a research and development company for production equipment, with 30 years of experience in the electronic components and solar cell industries. We have customized and manufactured various printing machines, including a printing system for chip resistors, as well as wiring arrangement machines for solar cells, wafer transfer measurement devices, and packaging equipment for various companies.
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