Just enter the minimum necessary information online! Semiconductor package model creation tool.
"Simcenter Flotherm PACK" is a tool that allows you to create and provide thermal analysis models for semiconductor packages in just a few minutes online. By accessing the product's website through a web browser and entering the minimum required information, the semiconductor package model data is automatically generated. You can then download it and load it into "Simcenter Flotherm" or "Simcenter Flotherm PCB" to perform the analysis. Not only does this dramatically reduce the time required for model creation, but it also significantly contributes to high-precision predictions of junction and case temperatures. 【Features】 - Supports over 30 types of semiconductor package types - JEDEC-compliant data sheet input - Allows inference from package type even without knowledge of internal structure - Detailed model creation that replicates heat dissipation pathways - Creation of 2-resistor and multi-resistor models (DELPHI model) through automatic thermal resistance calculation - Various JEDEC measurement devices can also be downloaded simultaneously *For more details, please refer to the PDF materials or feel free to contact us.
Inquire About This Product
basic information
【Selectable Modeling Levels】 ■Detailed Model: While simplifying by utilizing thermal equivalence, model the internal structure as detailed as possible. ■Resistance Model: A simplified model of the shape using two thermal resistances, in the format described in the manufacturer's catalog. ■DELPHI Model: A thermal resistance model that is more detailed than the two-resistance model, modeled with six or more thermal resistances. *For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
【Purpose】 ■Creation of semiconductor package component data *For more details, please refer to the PDF document or feel free to contact us.*
catalog(2)
Download All CatalogsNews about this product(2)
Company information
While focusing on MBD and CAE technologies and their surrounding technical areas, we specialize in building virtual products and collaborative design processes through cutting-edge digital engineering. We have formed partnerships with leading software vendors of the era to provide top-level digital engineering technologies in Japan, including solutions for thermal fluid analysis, structural analysis, electromagnetic field analysis, acoustic analysis, system simulation, optimization technologies, embedded software development environments, and simulation process data management (SPDM) solutions. We offer a comprehensive engineering environment necessary to solve the diverse and complex challenges faced by our customers. Official Blog: https://www.idaj.co.jp/blog/ IDAJ YouTube Channel: https://www.youtube.com/channel/UCGCd8pB5Lwq_noIoxpgJrrw/featured X: https://twitter.com/IDAJ_CAE Facebook: https://www.facebook.com/IDAJ.CAE